Monitoring System of Semiconductor Machine Vibration

Monitoring the operation of the machine to produce excessive vibration, arranging the PM replacement parts in advance to reduce the Wafer defect rate of production line due to excessive vibration generated

Monitoring the operation of the semiconductor machine vibration, reducing the process of various types of Wafer defect rate due to excessive vibration generated.

MSD MEMS 3 Axis SPECIFICATION

• Measurement：+/-2000mg
• Axis：X, Y, Z
• Sensitivity：0.01g
• Output Data Rate(Hz) ：50Hz
• Sensor Number：1 CH
• Up/Low Limitation Alarm Setting
• Alarming Buzzer
• Offset Setting
• Zero Setting
• NC/NO Alarm output
• RS-485(Modbus)